| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board on which a wiring pattern of high precision can be formed.SOLUTION: A manufacturing method for a wiring board 1 includes, preparing a lamination wiring board 35 having a wiring pattern 4 on a region containing at least a rear side of a via hole formation scheduled region 16, on the other surface of a core wiring plate 2 (insulating layer), with a wiring pattern 3 containing a land 13 surrounding an opening part 12 which is patterned with a copper foil layer 11 provided on one surface of the core wiring plate 2, and with the via hole formation scheduled region being exposed from the opening part, making the wiring pattern 4 to be exposed on a bottom of a hole part 18 by forming the hole part, forming a power feeding layer 22 by electroless copper plating, forming a resist 32 which does not cover a region outside the land 13, packing the hole part and the opening part with copper plating by electric copper plating that utilizes the power feeding layer, removing the resist, and removing the power feeding layer while leaving the wiring pattern out.</p> |
