TEMPORARY ADHESIVE FOR MANUFACTURING SEMICONDUCTOR APPARATUS, ADHESIVE SUPPORT USING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a temporary adhesive for manufacturing a semiconductor apparatus which can reduce the problem that the temporary adhesive emits gas in the temporary support at high temperature when a member to be processed (such as a semiconductor wafer) is subjected to mechanical and chemical treatment and can easily release the temporal support to the member to be processed without damaging the member to be processed even after the high temperature process.SOLUTION: There is provided a temporary adhesive for manufacturing a semiconductor apparatus which comprises: (A) a radical polymerizable monomer; (B) a polymeric compound; (C) an aromatic ketone compound; and (D) an amine compound.