发明名称 COMPOSITE CONTAINER LID COMPRISING IC TAG
摘要 PROBLEM TO BE SOLVED: To provide a packaging container in which an IC tag is reliably destroyed at the time of opening.SOLUTION: An inner cap 10 comprises a top plate 11 and a cylindrical wall 12 including a screw thread hanging from a peripheral edge of the top plate, in which its inner surface engages with a mouth outer surface of a container by screwing on. On an upper surface of the top plate, an IC tag having an antenna circuit is attached. An over-cap comprises a top wall panel and a skirt hanging from a peripheral edge of the top wall panel. On a lower surface of the top wall panel, a projection with a sharp tip is formed so as to be a cutter for breaking the antenna circuit of the IC tag. The IC tag consists of a resin film including at least an IC chip and a plurality of adjacent antenna lines. The projection with the sharp tip of the over-cap has cutting blades at least at both ends in a direction orthogonal to an arrangement direction of the adjacent antenna lines, and a maximum width between the cutting blades of both ends is longer than a space between the adjacent antenna lines.
申请公布号 JP2014189306(A) 申请公布日期 2014.10.06
申请号 JP20130067084 申请日期 2013.03.27
申请人 TOYO SEIKAN KAISHA LTD;NIPPON CLOSURES CO LTD 发明人 ARAI TOSHIYUKI;KUROSAWA TAKAHIRO;SAWARA TORU;SUGI MAMIKO
分类号 B65D51/24;B65D41/04;B65D55/02;G06K19/07;G06K19/077 主分类号 B65D51/24
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