| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal substrate for an LED which not only has high-luminance and high-heat-dissipation functions but also is capable of reliably mounting an LED element without skill by paying attention to other metal having characteristics (being a material which is immune to high temperature, reduces a coefficient of thermal expansion and is extremely stabilized even in vacuum) with quality close to Mo as a core material of the metal substrate, and improving other metal.SOLUTION: In a core substrate of a CuW alloy, a plating layer is formed for improving hardness of CuW via an underlying plating layer of an Ni or Ni-P alloy. The plating layer is any one of (1) an alloy adjusting plating layer 3 of AuSn, (2) a composite adjusting plating layer 4 of a lamination of Au and Sn, and (3) a composite adjusting plating layer 5 of a lamination of In and Au. The substrate can be adhered with an epitaxial layer of an LED element by the plating layer. |
