METHOD FOR MANUFACTURING PACKAGE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, ELECTRONIC EQUIPMENT, MOBILE, AND LID BODY AGGREGATE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a package with good productivity, a method for manufacturing an electronic device, an electronic device, electronic equipment, a mobile, and a lid body aggregate.SOLUTION: A method for manufacturing a package repeats, a plurality of times, a step including the steps of: positioning at least one lid body 130 included in a lid substrate 600 having a plurality of lid bodies 130 at a base region 120A included in a base substrate 200 having a plurality of base regions 120A; bonding the lid body 130 and the base region 120A; and detaching the lid body 130 from the lid substrate 600.