| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring board having good electrical insulation between semiconductor element connection pads.SOLUTION: A wiring board A comprises: an insulating substrate 1 having a mounting part 1a for a semiconductor element S on a top face; semiconductor element connection pads 2 arranged on a periphery of the mounting part 1a in an inner line and an outer line which are parallel with each other along a periphery of the semiconductor element S; wiring conductors 3 which extend from the semiconductor element connection pads 2 in the inner line to a central part side of the mounting part 1a and extend from the semiconductor element connection pads 2 in the outer line to the outside of the mounting part 1a; and a solder resist layer 5 which is deposited on the top face of the insulating substrate 1 so as to expose the semiconductor element connection pads 2 and covers the wiring conductors 3 and has a belt-like solder dam 5a between the inner line and the outer line, in which at one end of each semiconductor element connection pad 2 on the solder dam 5a side, an extension part 7 which extends to below the solder dam 5a is added and a width of the extension part 7 decreases from the semiconductor element connection pad 2 side toward the solder dam 5a side.</p> |
