| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which a semiconductor chip is solder bonded to a metal plate and resin molded and the metal plate and a resin package are unlikely to be separated.SOLUTION: A semiconductor device 10 disclosed in the present specification comprises: a metal plate 3; a semiconductor chip 5 fixed to the metal plate 3 via a solder layer 8; and a resin package 12 which is in contact with the metal plate 3 and molds the semiconductor chip 5. The semiconductor device 10 includes a dent 4 in the metal plate 3 so as to be adjacent to an edge of a fillet 8a of the solder layer 8 when viewed from above the metal plate 3. An excess primer gathered around the edge of the fillet flows into the dent 4 thereby to prevent increase in film thickness of the primer. |
