TEMPORARY ADHERING LAMINATE FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a temporary adhering laminate for manufacturing a semiconductor apparatus which can temporarily support a member to be processed securely and easily when the member to be processed (such as a semiconductor wafer) is subjected to mechanical and chemical treatment and can easily release the temporal support to the member to be processed without damaging the member to be processed even after the high temperature process, and to provide a method for manufacturing a semiconductor apparatus.SOLUTION: There is provided a temporary adhering laminate for manufacturing a semiconductor apparatus which has (A) a peeling layer and (B) an adhesive layer, where the peeling layer comprises: (a1) a liquid compound at 25°C which has a temperature where the weight is reduced by 5 mass% is 250°C or more when measured under a constant temperature raising condition of 20°C/min under a nitrogen gas stream; and (a2) a binder which has a temperature where the weight is reduced by 5 mass% is 250°C or more when measured under a constant temperature raising condition of 20°C/min under a nitrogen gas stream.