发明名称 RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a sealing material of an optical semiconductor device having a long life and excellent mass productivity, and a composition having a moderate viscosity capable of providing such a sealing material.SOLUTION: A resin composition comprises 5-40 mass% of a copolymer comprising a repeating unit represented by the formula (I) and a repeating unit represented by the formula (II), 5-20 mass% of triglycidyl isocyanurate and 40-60 mass% of acid anhydride.
申请公布号 JP2014189587(A) 申请公布日期 2014.10.06
申请号 JP20130064584 申请日期 2013.03.26
申请人 OSAKA ORGANIC CHEM IND LTD 发明人 OKADA YASUNARI;KONO NAOYA
分类号 C08G59/42;C08G59/20;H01L23/29;H01L23/31;H01L33/56 主分类号 C08G59/42
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