| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which prevents corrosion of a lead wire and achieves improves reliability.SOLUTION: A semiconductor device 1 comprises: a substrate 2 having electrodes 20 and a plurality of lead wires 30 connected to the electrodes 20; and a semiconductor element 3 which is rectangular and has long sides 301, short sides 302 and corners 303, and which is mounted on the substrate 2, in which the semiconductor element has bumps 40 connected to the electrodes 20. The semiconductor device 1 comprises: an underfill 50 expanded between the substrate 2 and the semiconductor element 3 and on the substrate 2 around the semiconductor element 3; and an overcoat 60 which covers the lead wires 30 on the substrate 2. Among the lead wires 30, at least a lead wire which is connected to an electrode corresponding to the bump 40 arranged along the long side 301 and closest to the corner 303 of the semiconductor element 3 has at least two sequential bent parts which are formed to bent in the same direction and wired on the side of the short side of the semiconductor element 3 in planar view. |
