发明名称 Si OPTICAL INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To suppress the occurrence of displacement and a defect at a boundary face between a Ge optical function element and a waveguide, and to improve the characteristic and reliability of each Ge optical function element pertaining to an Si optical integrated circuit device and a manufacturing method therefor.SOLUTION: A first p-type Si layer and a second p-type Si layer separated by an i-type Si layer are provided in an i-type single crystal Si layer on a substrate surface; a first optical function element part including a Ge layer is formed on top of the first p-type Si layer using it as a contact layer; a second optical function element part including the Ge layer is formed on top of the second p-type Si layer using it as a contact layer; and the first optical function element part and the second optical function element part are connected together with a connection waveguide part comprising an i-type Ge layer.
申请公布号 JP2014192472(A) 申请公布日期 2014.10.06
申请号 JP20130068931 申请日期 2013.03.28
申请人 FUJITSU LTD 发明人 OKUMURA JIICHI
分类号 H01L31/10;G02B6/122;G02F1/025;H01S5/32;H01S5/50 主分类号 H01L31/10
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