COMPOSITION, CURED PRODUCT, LAMINATE, PRODUCTION METHOD OF UNDERLAY FILM, PATTERN FORMING METHOD, PATTERN, AND PRODUCTION METHOD OF SEMICONDUCTOR RESIST

摘要

PROBLEM TO BE SOLVED: To provide a composition capable of giving an underlay film having excellent adhesiveness to a substrate and an imprint layer, excellent in-plane uniformity of film thickness, and a low defect density.SOLUTION: The composition comprises a polymerizable compound, a first solvent, and a second solvent. The first solvent has a boiling point of 160°C or higher under 1 atmospheric pressure, while the second solvent has a boiling point of lower than 160°C under 1 atmospheric pressure. The polymerizable compound is included by less than 1 mass% in the composition.