| 摘要 |
PROBLEM TO BE SOLVED: To provide an art to satisfy both of inhibition of wire sweep of a bonding wire and inhibition of deterioration in solder caused by a difference in thermal expansion coefficients of a semiconductor chip and a metal plate.SOLUTION: A semiconductor device 2 comprises: a tabular chip 4; a plurality of bonding wires 6; a resin coating 9; and a resin package 5. The chip 4 is solder bonded to a metal plate 12. The plurality of bonding wires 6 connects the chip 4 and connection terminals 7. The resin coating 9 integrally covers the plurality of bonding wires 6 to tie the plurality of bonding wires 6 together and covers the chip 4, and covering of the bonding wires and covering of the semiconductor chip are connected to each other. The resin package 5 contacts the metal plate 12 and encapsulates the covered bonding wires 6 and chip 4. A difference in thermal expansion coefficients of the resin package 5 and the metal plate 12 is smaller than a difference in thermal expansion coefficients of the resin coating 9 and the metal plate 12. In addition, lateral faces of the tabular chip 4 are surrounded by a resin of the resin package 5. |
