发明名称 COOLING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a cooling device capable of satisfactorily cooling an electronic component while suppressing an increase of loss in the electronic component.SOLUTION: A cooling device 10 has a flow path 12 in its inside for cooling water and is arranged to be in contact with a reactor 1, which is provided as an electronic component. The cooling device 10 is capable of satisfactorily cooling the reactor 1 by heat exchange between the reactor 1 and the cooling water in the flow path 12 via a heat transfer part 15h of a cooling plate 15. The heat transfer part 15h of the cooling plate 15, which is a constituent of the cooling device 10, is provided with a non-conductive part 17. Consequently, it becomes possible to impede or interrupt an eddy current flow caused by a magnetic flux generated around the reactor 1 by means of the non-conductive part 17 of the heat transfer part 15h. This reduces the eddy current generated around the cooling device 10 to thereby suppress an increase of loss in the reactor 1, that is, eddy current loss.</p>
申请公布号 JP2014187117(A) 申请公布日期 2014.10.02
申请号 JP20130059856 申请日期 2013.03.22
申请人 TOYOTA MOTOR CORP 发明人 YOSHIDA TADASHI
分类号 H05K7/20;H01F27/22;H01F37/00;H01L23/473 主分类号 H05K7/20
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