发明名称 LIGHT EMITTING DIODE DEVICE AND METHOD FOR MANUFACTURING SAME
摘要 An LED device includes a substrate having a top surface and a bottom surface. The substrate defines a through hole at a center thereof. The LED device also includes an electrode board. The electrode board defines a concave portion at a center thereof, and a convex portion connected to and surrounding two sides of the concave portion. The concave portion includes a first electrode and a second electrode isolated from each other, and is located in the through hole of the substrate. A bottommost surface of the concave portion is substantially coplanar with the bottom surface of the substrate, and a top surface of the convex portion is substantially coplanar with the top surface of the substrate. An LED chip is arranged on the concave portion, and is electrically connected to the first electrode and the second electrode. A method for manufacturing plural such LED devices is also provided.
申请公布号 US2014291720(A1) 申请公布日期 2014.10.02
申请号 US201314085804 申请日期 2013.11.21
申请人 ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. 发明人 LO HSING-FEN;CHEN LUNG-HSIN
分类号 H01L33/48 主分类号 H01L33/48
代理机构 代理人
主权项 1. A light emitting diode (LED) device comprising: a substrate having a top surface and a bottom surface at opposite sides thereof, the substrate defining a through hole; an electrode board having a concave portion received in the through hole of the substrate and a convex portion connected to and surrounding two sides of the concave portion, the concave portion comprising a first electrode and a second electrode spaced from the first electrode, a bottommost surface of the concave portion being substantially coplanar with the bottom surface of the substrate, and a top surface of the convex portion being substantially coplanar with the top surface of the substrate; and an LED chip arranged in the concave portion and electrically connected to the first electrode and the second electrode.
地址 Hsinchu Hsien TW