METHOD OF MAKING HYBRID WIRING BOARD WITH BUILT-IN STIFFENER AND INTERPOSER AND HYBRID WIRING BOARD MANUFACTURED THEREBY

摘要

The present invention relates to a method of making a hybrid wiring board. In accordance with a preferred embodiment, the method includes: preparing a dielectric layer and a supporting board including a stiffener, a bump/flange sacrificial carrier and an adhesive, wherein the adhesive bonds the stiffener to the sacrificial carrier and the dielectric layer covers the supporting board; then removing the bump and a portion of the flange to form a cavity and expose the dielectric layer; then mounting an interposer into the cavity; and then forming a build-up circuitry that includes a first conductive via in direct contact with the interposer and provides signal routing for the interposer. Accordingly, the direct electrical connection between the interposer and the build-up circuitry is advantageous to high I/O and high performance, and the stiffener can provide adequate mechanical support for the build-up circuitry and the interposer.

主权项

1. A method of making a hybrid wiring board with built-in interposer, comprising:
providing a dielectric layer and a supporting board that includes a sacrificial carrier, a stiffener and an adhesive, wherein (i) the sacrificial carrier includes a bump and a flange, (ii) the bump is adjacent to and integral with the flange and extends from the flange in a first vertical direction, (iii) the flange extends laterally from the bump in lateral directions orthogonal to the first vertical direction, (iv) the stiffener is attached to the sacrificial carrier via the adhesive between the stiffener and the flange and between the stiffener and the bump, and (v) the dielectric layer covers the supporting board in the first vertical direction; removing the bump and a portion of the flange adjacent to the bump to form a cavity and expose the dielectric layer from a closed end of the cavity, wherein the cavity is laterally covered and surrounded by the adhesive and faces in a second vertical direction opposite the first vertical direction; mounting an interposer into the cavity, wherein the interposer includes a first contact pad that faces the first vertical direction and a second contact pad that faces the second vertical direction; and forming a build-up circuitry that covers the interposer and supporting board in the first vertical direction and includes a first conductive via that directly contacts the first contact pad of the interposer to provide an electrical connection between the interposer and the build-up circuitry.