STACKED MULTILAYER STRUCTURE

摘要

Disclosed is a stacked multilayer structure, including a first circuit layer having bumps, a plastic film stacked on the first circuit layer to fill up the space among the bumps so as to form a co-plane, and a second circuit layer formed on the co-plane and connected to the first circuit layer. The plastic film includes a glass fiber layer which is embedded and not exposed. The adhesion between plastic film and the second circuit layer is greatly improved because the glass fiber layer of the plastic film filling up the space among the bumps is not deformed and exposed outwards. Therefore, the yield and reliability of the stacked multilayer structure is increased.

主权项

1. A stacked multilayer structure, comprising:
a first circuit layer having a plurality of bumps; a plastic film stacked on the first circuit layer to fill up the space among the bumps so as to form a co-plane, wherein the plastic film comprises a glass fiber layer which is embedded and not exposed; and a second circuit layer formed on the co-plane and connected to the first circuit layer.