发明名称 THIN-FILM SURFACE PLANARIZATION METHOD AND ARRAY SUBSTRATE MANUFACTURING METHOD
摘要 <p>The present invention relates to the field of displays. Disclosed are a thin-film surface planarization method and an array substrate manufacturing method, capable of solving the technical problem that the existing dry etching substantially impairs the surface smoothness of the other film layers under an etched film layer, thus improving the display performance of a liquid crystal display. The array substrate manufacturing method comprises: employing dry etching to etch a pattern on a nonmetal layer (4), and then planarizing the surface of a first film layer (3) to allow the first film layer (3) with a rough surface resulting from dry etching to regain surface smoothness, the first film layer (3) being located under the nonmetal layer (4).</p>
申请公布号 WO2014153839(A1) 申请公布日期 2014.10.02
申请号 WO2013CN76811 申请日期 2013.06.05
申请人 BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.;BOE TECHNOLOGY GROUP CO., LTD. 发明人 CHEN, LEI;XIA, ZIQI;DAI, WUKUN;LI, JIAPENG;JIN, XIUHONG;WANG, FENGGUO;ZHANG, LEI;QIU, MIAO
分类号 H01L21/306 主分类号 H01L21/306
代理机构 代理人
主权项
地址
您可能感兴趣的专利