| 摘要 |
PROBLEM TO BE SOLVED: To provide a film formation apparatus for a metal film which can form a metal film of a desired film thickness continuously on the surfaces of a plurality of substrates and allows increasing the film formation speed while suppressing occurrence of abnormalities in the metal film and a method of forming the metal film.SOLUTION: A film formation apparatus 1A includes an anode 11, a solid electrolyte membrane 13 arranged with a metal ion solution L on the side of the anode 11 between the anode 11 and a substrate B serving as a cathode and a power source part E applying a voltage between the anode 11 and the substrate B, and a metal film F composed of the metal of the metal ion is formed by applying a voltage between the anode 11 and the substrate B to precipitate the metal ion as the corresponding metal onto the surface of the substrate B. The anode 11 consists of a base material 11a which has insolubility in the metal ion solution L and is coated with a metal plating film 11c composed of the same metal as that of the metal film F. |
