| 摘要 |
PROBLEM TO BE SOLVED: To improve assemblability of a semiconductor device.SOLUTION: In a semiconductor device manufacturing method, a memory chip is mounted on a logic chip 1 by imaging of a recognition range C including a recognition mark 1h formed on a rear face of the logic chip 1 to recognize a pattern of the recognition range C and a plurality of bumps 1e of the logic chip 1 and a plurality of bump electrodes of the memory chip are aligned with one another based on the recognition result when the memory chip is mounted on the logic chip 1. On this occasion, the pattern of the recognition range C is different from any part of an alignment pattern of the plurality of bumps 1e, and consequently the recognition mark 1h in the pattern of the recognition range C can be successfully recognized thereby to achieve highly accurate alignment of the plurality of bumps 1e of the logic chip 1 and the plurality of bump electrodes of the memory chip. |
