发明名称 |
DEVICE FOR THINNING RESIST LAYER |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a device for thinning a resist layer for forming a resist pattern that can solve problems about resolution and followability, the device capable of solving such a problem that a reduced amount of a resist layer is uneven within a substrate plane caused by a slow and uneven liquid flow.SOLUTION: The device for thinning a resist layer includes: a thinning unit which forms micelles of a photo-crosslinking resin component in a resist layer by a thinning liquid; and a micelle removing unit which removes micelles by a micelle removing liquid. The micelle removing unit includes micelle removing liquid supply sprays for supplying the micelle removing liquid; and the micelle removing liquid sprays are oriented in a single direction.</p> |
申请公布号 |
JP2014187352(A) |
申请公布日期 |
2014.10.02 |
申请号 |
JP20130272594 |
申请日期 |
2013.12.27 |
申请人 |
MITSUBISHI PAPER MILLS LTD |
发明人 |
TOYODA YUJI;GOKAN HIROHIKO;KAWAI NOBUYUKI;NAKAGAWA KUNIHIRO |
分类号 |
H05K3/06;G03F7/38;H01L21/027;H05K3/28 |
主分类号 |
H05K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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