发明名称 DEVICE FOR THINNING RESIST LAYER
摘要 <p>PROBLEM TO BE SOLVED: To provide a device for thinning a resist layer for forming a resist pattern that can solve problems about resolution and followability, the device capable of solving such a problem that a reduced amount of a resist layer is uneven within a substrate plane caused by a slow and uneven liquid flow.SOLUTION: The device for thinning a resist layer includes: a thinning unit which forms micelles of a photo-crosslinking resin component in a resist layer by a thinning liquid; and a micelle removing unit which removes micelles by a micelle removing liquid. The micelle removing unit includes micelle removing liquid supply sprays for supplying the micelle removing liquid; and the micelle removing liquid sprays are oriented in a single direction.</p>
申请公布号 JP2014187352(A) 申请公布日期 2014.10.02
申请号 JP20130272594 申请日期 2013.12.27
申请人 MITSUBISHI PAPER MILLS LTD 发明人 TOYODA YUJI;GOKAN HIROHIKO;KAWAI NOBUYUKI;NAKAGAWA KUNIHIRO
分类号 H05K3/06;G03F7/38;H01L21/027;H05K3/28 主分类号 H05K3/06
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