发明名称 COMPOSITIONS AND PROCESSES FOR PHOTOLITHOGRAPHY
摘要 Topcoat layer compositions are provided that are applied above a photoresist composition. The compositions find particular applicability to immersion lithography processing.
申请公布号 US2014295348(A1) 申请公布日期 2014.10.02
申请号 US201414301177 申请日期 2014.06.10
申请人 Rohm and Haas Electronic Materials LLC 发明人 WANG Deyan;WU Chunyi
分类号 G03F7/11 主分类号 G03F7/11
代理机构 代理人
主权项 1. A composition suitable for use in forming a topcoat layer over a layer of photoresist, the composition comprising: a first resin, a second resin and a third resin which are different from each other, wherein the first resin comprises one or more fluorinated groups and is present in the composition in a larger proportion by weight than the second and third resins individually, wherein the second resin has a lower surface energy than a surface energy of the first resin and the third resin, wherein the second resin is substantially immiscible with the first resin, and wherein the third resin comprises one or more strong acid groups.
地址 Marlborough MA US