| 发明名称 |
COVERLAY FOR HIGH-FREQUENCY CIRCUIT SUBSTRATE |
| 摘要 |
To provide a coverlay for a high-frequency circuit substrate, that uses polyimide film and fluororesin, has excellent mechanical properties and heat resistance, and can increase workability during the manufacture of high-frequency circuit substrates. Resolution Means: The coverlay for a high-frequency circuit substrate including a polyimide film and a fluororesin bonded together, and an adhesive strength between the polyimide film layer and the fluororesin layer being greater than 3.0 N/cm. |
| 申请公布号 |
US2014295189(A1) |
申请公布日期 |
2014.10.02 |
| 申请号 |
US201414230298 |
申请日期 |
2014.03.31 |
| 申请人 |
E I DU PONT DE NEMOURS AND COMPANY |
发明人 |
HIDAKA SHOTARO;TANAKA TAKESHI;MACHIDA HIDEAKI;INABA TAKESHI;MURAKAMI SHINYA |
| 分类号 |
H05K1/03;B32B27/34;B32B27/32;B32B27/08 |
主分类号 |
H05K1/03 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A coverlay for a high-frequency circuit substrate, the coverlay comprising a polyimide film and a fluororesin bonded together, and an adhesive strength between the polyimide film layer and the fluororesin layer being greater than 3.0 N/cm. |
| 地址 |
Wilmington DE US |
