CIRCUIT SUBSTRATE, SEMICONDUCTOR PACKAGE AND PROCESS FOR FABRICATING THE SAME

摘要

A circuit substrate has the following elements. A stacked circuit structure has a first surface and a second surface opposite thereto surface. A first patterned inner conductive layer is disposed on the first surface and has multiple pads. A first patterned outer conductive layer is disposed on the patterned inner conductive layer and has multiple conductive pillars, wherein each of the first conductive pillar is located on the corresponding first pad. The first dielectric layer covers the first surface, the first patterned inner conductive layer and the first patterned outer conductive layer, and has multiple first concaves, wherein the first concave exposes the top and side of the corresponding first conductive pillar. A semiconductor package structure applied the above circuit substrate and a process for fabricating the same are also provided here.

主权项

1. A circuit substrate, comprising:
a stacked circuit structure having a first surface and a second surface opposite to the first surface; a first patterned inner conductive layer disposed on the first surface and having a plurality of first pads; a first patterned outer conductive layer disposed on the first patterned inner conductive layer and having a plurality of first conductive pillars, wherein each of the first conductive pillars is located on the corresponding first pad; and a first dielectric layer covering the first surface, the first patterned inner conductive layer and the first patterned outer conductive layer and having a plurality of first concaves, wherein each of the first concaves exposes a top and a side of the corresponding first conductive pillar.