| 摘要 |
A substrate processing device (1) according to an embodiment is provided with: a supporting portion (4) which supports a substrate (W) within a plane; a rotation mechanism (5) which uses an axis intersecting the surface of the substrate (W) supported by the supporting portion (4) as a rotational axis so as to rotate the supporting portion (4); a plurality of nozzles (6a, 6b, 6c) which are disposed so as to be aligned from the center to the perimeter of the substrate (W) that is supported by the supporting portion (4), and which each deliver processing liquid to the surface of the substrate (W) that is upon the supporting portion (4), which is rotating by way of the rotation mechanism (5); and a control unit (9) which delivers the processing liquid at delivery timings that are different for each of the plurality of nozzles (6a, 6b, 6c) in accordance with thickness of a liquid membrane of the processing liquid formed on the surface of the substrate (W) that is upon the supporting portion (4) that is rotating by way of the rotation mechanism (5). |
