CERAMIC CIRCUIT BOARD AND PROCESS FOR PRODUCING SAME

摘要

According to one embodiment, a ceramic circuit board includes a ceramic substrate, a copper circuit plate and a brazing material protrudent part. The copper circuit plate is bonded to at least one surface of the ceramic substrate through a brazing material layer including Ag, Cu, and Ti. The brazing material protrudent part includes a Ti phase and a TiN phase by 3% by mass or more in total, which is different from the total amount of a Ti phase and a TiN phase in the brazing material layer that is interposed between the ceramic substrate and the copper circuit plate. The number of voids each having an area of 200 μm2 or less in the brazing material protrudent part is one or less (including zero).

主权项

1. A method for the production of a ceramic circuit board, comprising:
providing a first masking on a part other than an area to be a copper circuit pattern and a brazing material protrudent part on a ceramic substrate; forming a brazing material layer comprising Ag, Cu and Ti on an area other than the first masking on the ceramic substrate; mounting a copper plate on the brazing material layer and bonding the ceramic substrate and the copper plate by heating; providing a second masking on an area to be a copper circuit pattern on the copper plate; and forming a copper circuit pattern by etching.