发明名称 |
METHOD FOR FABRICATING STACK DIE PACKAGE |
摘要 |
In one embodiment, a method can include coupling a gate and a source of a first die to a lead frame. The first die can include the gate and the source that are located on a first surface of the first die and a drain that is located on a second surface of the first die that is opposite the first surface. In addition, the method can include coupling a source of a second die to the drain of the first die. The second die can include a gate and a drain that are located on a first surface of the second die and the source that is located on a second surface of the second die that is opposite the first surface. |
申请公布号 |
WO2014159469(A1) |
申请公布日期 |
2014.10.02 |
申请号 |
WO2014US23790 |
申请日期 |
2014.03.11 |
申请人 |
VISHAY-SILICONIX |
发明人 |
TERRILL, KYLE;KUO, FRANK;MAO, SEN |
分类号 |
H01L23/12 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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