| 摘要 |
<p>Provided is a laminate for temporary bonding in semiconductor device manufacture, the laminate enabling the reliable and easy provision of temporary support for a member (such as a semiconductor wafer) being mechanically or chemically processed, the temporary support being easily be removable, even after high-temperature processing, without damaging the member when processing has been completed. Also provided is a semiconductor device manufacturing method. This laminate for temporary bonding in semiconductor device manufacture has (A) a release layer and (B) an adhesive layer, and the release layer (A) includes (a1) a first release layer which is adjacent to the adhesive layer (B) and has a softening point of 200°C or greater, and (a2) a second release layer which is adjacent to the first release layer (a1) and includes a resin, 5 mass% or more of which resin dissolves at 25°C in at least one of prescribed solvents after curing.</p> |
