WAFER LEVEL PACKAGE STRUCTURE AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a wafer level package manufacturing method which achieves low manufacturing costs.SOLUTION: A wafer level package manufacturing method includes: a resin formation step where an insulative first resin including a groove in which wiring is formed is formed on a surface of a substrate by pressing a resin with a mold and hardening the resin; an oxygen dry etching step where the first resin is etched by oxygen dry etching to expose a part of the surface of the substrate; a first film formation step where a first metal film forming a part of the wiring is formed on a surface of the first resin and the groove; a second film formation step where a second metal film forming a part of the wiring is formed on a surface of the first metal film; an etching step where the first metal film and the second metal film are etched after the second film formation step; an installation step where a cutting blade is installed at a height range from an upper surface to a lower surface of the first resin; and a cutting step where the cutting blade is run to cut at least the first resin.