发明名称 SUBSTRATE FILM FOR DICING SHEET, DICING SHEET, METHOD OF PRODUCING SUBSTRATE FILM FOR DICING SHEET, AND METHOD OF MANUFACTURING CHIP-LIKE MEMBER
摘要 PROBLEM TO BE SOLVED: To provide a dicing sheet capable of reducing occurrence of dicing debris, and reducing the possibility of occurrence of problems when a polyolefin-based film is irradiated with an electron beam in the process of manufacturing its component, i.e., a substrate film, and to provide the component of the dicing sheet, i.e., a substrate film, a method of manufacturing the dicing sheet, and a method of manufacturing a chip-like member.SOLUTION: In a substrate film 2 for dicing sheet including a polyolefin-based film irradiated with an electron beam, irradiation of an electron beam for the polyolefin-based film is performed to satisfy following conditions (a)-(c) entirely. (a) Cumulative irradiation of electron beam is 115 kGy or more, (b) Cumulative irradiation time of electron beam is 8 sec or less, and (c) Irradiation amount of electron beam per irradiation is 135 kGy or less.
申请公布号 JP2014187244(A) 申请公布日期 2014.10.02
申请号 JP20130061600 申请日期 2013.03.25
申请人 LINTEC CORP 发明人 YAMASHITA SHIGEYUKI;NISHIDA TAKUO;KATA AKIO
分类号 H01L21/301 主分类号 H01L21/301
代理机构 代理人
主权项
地址