| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a cooler with improved cooling performance, and to provide a manufacturing method of the cooler.SOLUTION: A cooler 2 includes: a base plate 3 where a semiconductor chip 92 is attached to a front surface 3a; multiple fins 4 which are disposed on a rear surface 3b of the base plate 3 so as to be spaced away from each other; slits 6, each of which extends from a tip of the fin 4 to the base end side, the slits 6 which are formed arranged in an arrangement direction of the multiple fins 4; and a refrigerant nozzle 5 which jets a refrigerant to the slits 6. In side end parts 41 of the fins 4 which face the slits 6, closing members 21, each of which closes spaces 43 between the adjacent fins 4 from a predetermined height of each fin 4 to the tip, are fixed to the fins 4.</p> |
