| 摘要 |
An electronic component mounting structure, manufacturing method and an electronic component product; the electronic component mounting structure comprises a printed circuit board, a metal flange, and a plurality of electronic components provided on the metal flange; the printed circuit board is provided with a slot thereon, the slot wall being coated with a metal layer; the metal flange is restricted by the metal layer on the slot wall and therefore is fastened within the slot. The metal flange does not have a position offset because the metal flange is fastened within the slot of the PCB, thus improving product consistency. Further, in the manufacturing method of the electronic component mounting structure, since the PCB manufacturer has already secured a metal flange to a PCB, the electronic component manufacturer can directly mount an electronic component after obtaining a PCB, thereby eliminating intermediate links, improving production efficiency, and reducing cost. |
