| 发明名称 |
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
Disclosed herein is a printed circuit board including: an insulating layer having first and second surfaces; a first circuit layer formed on the first surface of the insulating layer and including at least one first circuit pattern; a second circuit layer formed on the first circuit layer and including at least one second circuit pattern; and an insulating film formed in an insulating region of the first and second circuit layers. |
| 申请公布号 |
US2014290982(A1) |
申请公布日期 |
2014.10.02 |
| 申请号 |
US201414208752 |
申请日期 |
2014.03.13 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
Lee Dong Uk;Kim Young Gon;Noh Seung Hyun |
| 分类号 |
H05K1/02;H05K3/46 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board comprising:
an insulating layer having first and second surfaces; a first circuit layer formed on the first surface of the insulating layer and including at least one first circuit pattern; a second circuit layer formed on the first circuit layer and including at least one second circuit pattern; and an insulating film formed in an insulating region of the first and second circuit layers. |
| 地址 |
Suwon-si KR |
