| 摘要 |
A probe device that allows precise testing over the long term is provided. Said probe device (100) is provided with a conductive-film electrode (220), an electrode plate (221), a contact probe (220), and a cleaning unit (410). The conductive-film electrode (220) is formed on a placement platform (111) on which a semiconductor wafer (W) is placed; specifically, on the surface of said placement platform (111) on which the semiconductor wafer (W) is placed. Furthermore, the conductive-film electrode (220) contacts a bottom-side electrode formed on the bottom side of a semiconductor device on the semiconductor wafer (W). The electrode plate (221) is electrically connected to a tester (300). The contact probe (220) is positioned to the side of the placement platform (111), is electrically connected to the conductive-film electrode (220), can be connected to the electrode plate (221), and electrically connects the tester (300) to the bottom-side electrode by abutting against the electrode plate (221). The cleaning unit (410) has a polishing unit that polishes the top surface of the contact probe (220), a brush unit (411) that performs brush cleaning on said top surface, and a contact-resistance measurement unit (413) that measures the contact resistance of said top surface. |
