发明名称 GROUND AND HEAT TRANSFER INTERFACE ON A PRINTED CIRCUIT BOARD
摘要 In one embodiment, a printed circuit board (PCB) assembly (522) includes a PCB (504), the PCB being arranged to define a through-hole therein, the through-hole having a surface, wherein the PCB includes a top surface and a bottom surface. The PCB assembly also includes a slug arrangement (562) and a surface mount component (524). The slug arrangement is formed from an electrically and thermally conductive material and includes at least a first portion (566) and a second portion (570, 574). At least a part of the first portion is positioned in the through-hole, and the second portion is coupled (578, 530) to the bottom surface. The surface mount component is positioned over the through-hole and the top surface, and has a first surface configured to contact the first portion (526b).
申请公布号 WO2014159368(A1) 申请公布日期 2014.10.02
申请号 WO2014US23239 申请日期 2014.03.11
申请人 CISCO TECHNOLOGY, INC. 发明人 MASS, JAMES A.;ARTMAN, DAVID LYNN;FRANK, TIMOTHY A.
分类号 H05K1/02;H05K3/00 主分类号 H05K1/02
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