发明名称 METHODS FOR CONTROLLING ACROSS WAFER DIRECTED SELF-ASSEMBLY
摘要 <p>A method (100) for treating a layered substrate including a layer of a block copolymer is provided. The method (100) includes identifying a non-uniformity in the layer of the block copolymer (120); controlling a process variable correlated to the non-uniformity in the layer of the block copolymer (140); and annealing the layer of the block copolymer under a process condition affected by the process variable (160) to compensate for at least a portion of the non-uniformity in the layer of the block copolymer to form a pattern comprising a plurality of domains having improved uniformity therein. The method (100) further provides a way for reducing a non- uniformity in a layered substrate comprising a layer of a block copolymer on a pre- patterned substrate.</p>
申请公布号 WO2014158441(A1) 申请公布日期 2014.10.02
申请号 WO2014US16766 申请日期 2014.02.18
申请人 TOKYO ELECTRON LIMITED;TOKYO ELECTRON U.S. HOLDINGS, INC. 发明人 SOMERVELL, MARK, H.
分类号 G03F7/00;G03F7/16 主分类号 G03F7/00
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