| 摘要 |
<p>In order to have excellent assemblability of a camera apparatus, while eliminating generation of an optical axis shift between an image pickup element and an optical lens, this camera apparatus has: a semiconductor device, which is formed by packaging an image pickup element using a sealing resin, said image pickup element receiving a luminous flux that has passed through an optical member, and outputting photoelectric conversion signals; a circuit board, which has lead terminals of the semiconductor device soldered thereto, and has an image processing circuit mounted thereon, said image processing circuit having the photoelectric conversion signals inputted thereto; and an aligning member, which has a first fitting section provided on the front surface having a predetermined planarity, said first fitting section aligning the semiconductor device, and which has the circuit board attached to the rear surface. The rear surface of the sealing resin of the semiconductor device has a predetermined planarity, and is provided with a second fitting section that fits in the first fitting section.</p> |
