| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet for processing a semiconductor which enables efficient role-to-role production and does not cause entrainment of air between a release sheet and the adhesive sheet for semiconductor processing during the production process.SOLUTION: An adhesive sheet 100 has an adhesive resin layer 2 and a film-like adhesive 10 on one side of a support sheet 1, and the film-like adhesive is formed in the outer peripheral part of the adhesive resin layer, has an adhesive strength to a silicon wafer (mirror surface) of 0.1 n/25 mm or higher, according to JIS Z0237;2009, and a retention power of 70,000 s or higher, in a creep test according to JIS Z1528;2009, and is composed of an adhesive composition containing a thermoplastic elastomer. |
