发明名称 INFRARED IMAGING DEVICE AND INFRARED IMAGING MODULE
摘要 <p>PROBLEM TO BE SOLVED: To provide an infrared imaging device and an infrared imaging module which are able to suppress manufacturing costs.SOLUTION: The infrared imaging device comprises: an infrared imaging element 31 including a semiconductor substrate having a recess, a pixel part provided on the recess and converting infrared into an electric signal; and a lid 33 including a lens part 331 facing the pixel part, and a flat plate part 332 provided around the lens part and bonded to the semiconductor substrate.</p>
申请公布号 JP2014186006(A) 申请公布日期 2014.10.02
申请号 JP20130062762 申请日期 2013.03.25
申请人 TOSHIBA CORP 发明人 ISHII KOICHI;FUNAKI HIDEYUKI;FUJIWARA KUNIO;HONDA HIRONAGA
分类号 G01J1/02;G01J5/48;H01L27/144;H04N5/33 主分类号 G01J1/02
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