| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a mounting method of an electronic component which improves joint reliability achieved when a terminal of an electronic component is welded to a through hole by a solder paste applied to the through hole.SOLUTION: In a mounting method of an electronic component, a solder paste is applied to a through hole of a printed circuit board on which an electronic component is mounted. The electronic component is placed on the printed circuit board in a state where a restriction member, which restricts a terminal of the electronic component from moving into the through hole, is sandwiched between the electronic component and the printed circuit board. Then, reflow soldering is performed at a temperature, at which the restriction member is melted, to weld the terminal into the through hole by the solder paste.</p> |
