发明名称 LIGHT-EMITTING ELEMENT PACKAGE
摘要 A light-emitting element package, according to one embodiment of the present invention, comprises: a circuit board including first and second regions having different heights; light-emitting elements respectively disposed in the first and second regions; and phosphor layers respectively disposed on the light-emitting elements, wherein the light-emitting elements are disposed within a 100-μm distance in the horizontal direction.
申请公布号 WO2014157905(A1) 申请公布日期 2014.10.02
申请号 WO2014KR02485 申请日期 2014.03.25
申请人 LG INNOTEK CO., LTD. 发明人 PARK, IN YONG;LEE, GUN KYO;LEE, JONG WOO;LEE, JU YOUNG;CHO, YUN MIN
分类号 H01L33/48;H01L33/50 主分类号 H01L33/48
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