发明名称 SEMICONDUCTOR ELEMENT, SEMICONDUCTOR DEVICE AND COMPOSITE MODULE
摘要 PROBLEM TO BE SOLVED: To reduce forward voltage of a diode formed in a semiconductor element.SOLUTION: In a semiconductor element, by forming a trench 9 on a surface of a P-type diffusion layer 3 different from a MOS structure 55 formation region and ensuring conduction between the trench 9 and a body electrode 8, a contact area of the body electrode 8 with the P-type diffusion layer 3 increases thereby to enable reduction in forward voltage of diodes 12, 13 formed on the semiconductor element.
申请公布号 JP2014187080(A) 申请公布日期 2014.10.02
申请号 JP20130059210 申请日期 2013.03.22
申请人 PANASONIC CORP 发明人 HIRAI EIICHI;OTA TOMONARI;IMAI TOSHIKAZU;OKAWA RYOSUKE
分类号 H01L29/868;H01L21/329;H01L25/04;H01L25/18;H01L27/04;H01L29/41;H01L29/78;H01L29/861;H01M2/10;H01M10/44 主分类号 H01L29/868
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