发明名称 |
SEMICONDUCTOR ELEMENT, SEMICONDUCTOR DEVICE AND COMPOSITE MODULE |
摘要 |
PROBLEM TO BE SOLVED: To reduce forward voltage of a diode formed in a semiconductor element.SOLUTION: In a semiconductor element, by forming a trench 9 on a surface of a P-type diffusion layer 3 different from a MOS structure 55 formation region and ensuring conduction between the trench 9 and a body electrode 8, a contact area of the body electrode 8 with the P-type diffusion layer 3 increases thereby to enable reduction in forward voltage of diodes 12, 13 formed on the semiconductor element. |
申请公布号 |
JP2014187080(A) |
申请公布日期 |
2014.10.02 |
申请号 |
JP20130059210 |
申请日期 |
2013.03.22 |
申请人 |
PANASONIC CORP |
发明人 |
HIRAI EIICHI;OTA TOMONARI;IMAI TOSHIKAZU;OKAWA RYOSUKE |
分类号 |
H01L29/868;H01L21/329;H01L25/04;H01L25/18;H01L27/04;H01L29/41;H01L29/78;H01L29/861;H01M2/10;H01M10/44 |
主分类号 |
H01L29/868 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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