发明名称 METAL-CERAMIC BONDED CIRCUIT BOARD AND PROCESSES OF MANUFACTURING AND INSPECTING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide processes of manufacturing and inspecting a metal-ceramic bonded circuit board by which it is reliably determined that dimensions of an entire region and all positions of a circuit pattern are within standard ranges with easy and a small number of steps.SOLUTION: The processes of manufacturing and inspecting a metal-ceramic bonded circuit board manufacture and inspect a pattern whose etching mask has a shape in which pattern dimensions are enlarged by a predetermined amount with reference to a predetermined pattern dimensions and include a pattern part for dimension measurements in which pattern dimensions are made to be further fatted or thinned within the predetermined pattern dimentional tolerance ranges with reference to the etching mask of a shape enlarged by the predetermined amount.
申请公布号 JP2014187078(A) 申请公布日期 2014.10.02
申请号 JP20130059175 申请日期 2013.03.21
申请人 DOWA HOLDINGS CO LTD 发明人 TSUKAGUCHI NOBUYOSHI
分类号 H05K3/06 主分类号 H05K3/06
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