发明名称 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device capable of reducing ON-resistance.SOLUTION: The semiconductor device comprises: an n-type SiC substrate which has first and second surfaces and contains a p-type impurity and an n-type impurity, and in which an element A is used as the p-type impurity and an element D is used as the n-type impurity, a combination of the element A and the element D is at least one combination of Al, Ga or In, N, B and P, a ratio of a concentration of the element A to a concentration of the element D forming the combination, is more than 0.40 and less than 0.95, the concentration of the element D is equal to or more than 1×10cmand equal to or less than 1×10cm; a SiC layer provided on the first surface; a first electrode provided at the first surface side; and a second electrode provided on the second surface.
申请公布号 JP2014187114(A) 申请公布日期 2014.10.02
申请号 JP20130059831 申请日期 2013.03.22
申请人 TOSHIBA CORP 发明人 OTA CHIHARU;SHIMIZU TATSUO;NISHIO JOJI;SHINOHE TAKASHI
分类号 H01L29/868;H01L21/28;H01L21/329;H01L21/337;H01L21/338;H01L27/098;H01L29/12;H01L29/16;H01L29/167;H01L29/41;H01L29/417;H01L29/47;H01L29/739;H01L29/78;H01L29/808;H01L29/812;H01L29/861;H01L29/872 主分类号 H01L29/868
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