| 发明名称 |
Cooling Electronic Components and Supplying Power to the Electronic Components |
| 摘要 |
A mechanism is provided for cooling electronic components of a printed circuit board module and for supplying power to the electronic components of the printed circuit board module. The computer module comprises a printed circuit board module, wherein the electronic components are attached to a first side of the printed circuit board module, and a cooling module being attached to a second side of the printed circuit board, being arranged in parallel to the printed circuit board and having a first layer being thermally and electrically conductive. The first layer is arranged such that heat is dissipated from the printed circuit board module and that power from a power source is supplied to the electronic components of the printed circuit board module. |
| 申请公布号 |
US2014293533(A1) |
申请公布日期 |
2014.10.02 |
| 申请号 |
US201414173233 |
申请日期 |
2014.02.05 |
| 申请人 |
International Business Machines Corporation |
发明人 |
Doering Andreas C.;Luijten Ronald P.;Michel Bruno;Paredes Stephan |
| 分类号 |
G06F1/20 |
主分类号 |
G06F1/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A computer module for cooling electronic components of a printed circuit board module and for supplying power to the electronic components of the printed circuit board module, the computer module comprising:
a printed circuit board module, wherein the electronic components are attached to a first side of the printed circuit board module, and a cooling module being attached to a second side of the printed circuit board, being arranged in parallel to the printed circuit board and having a first layer being thermally and electrically conductive, wherein the first layer is arranged such that heat is dissipated from the printed circuit board module Band that power from a power source is supplied to the electronic components of the printed circuit board module. |
| 地址 |
Armonk NY US |
