MONOLITHIC CERAMIC ELECTRONIC COMPONENT

摘要

A monolithic ceramic electronic component includes an outer electrode including a first plating layer formed directly on a component body by electroless plating so as to cover an exposed portion distribution region including exposed portions of a plurality of inner electrodes and a second plating layer formed by electrolytic plating so as to cover the first plating layer. An amount of extension of the first plating E1 and an amount of extension of the second plating E2 satisfy the relationship E1/(E1+E2)≦20%, where E1 represents a distance from an edge of the exposed portion distribution region to an edge of the first plating layer, and E2 represents a distance from the edge of the first plating layer to an edge of the second plating layer.

主权项

1. A monolithic ceramic electronic component comprising:
a component body including a plurality of stacked ceramic layers and a plurality of electrode layers arranged along the ceramic layers, the electrode layers each including an exposed portion exposed at a particular surface; and an outer electrode disposed on the particular surface of the component body so as to be electrically connected to the exposed portions of the electrode layers; wherein the exposed portions of the electrode layers define an exposed portion distribution region on the particular surface; the outer electrode includes:
a first plating layer that is an electrolessly plated layer disposed directly on the particular surface so as to cover the exposed portion distribution region; anda second plating layer that is an electrolytically plated layer that covers the first plating layer; and a following relationship is satisfied: (amount of extension of first plating)/{(amount of extension of first plating)+(amount of extension of second plating)}≦20%, where the amount of extension of first plating represents a distance from an edge of the exposed portion distribution region to an edge of the first plating layer, and the amount of extension of second plating represents a distance from the edge of the first plating layer to an edge of the second plating layer.