| 发明名称 |
ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME |
| 摘要 |
The disclosure provides an electronic device that includes a substrate and a lid. The lid is bonded on the substrate to seal an inside of the lid using a resin. The lid includes a contact surface in contact with the resin. The contact surface includes a rough surface with an uneven shape. |
| 申请公布号 |
US2014292143(A1) |
申请公布日期 |
2014.10.02 |
| 申请号 |
US201414217503 |
申请日期 |
2014.03.18 |
| 申请人 |
NIHON DEMPA KOGYO CO., LTD. |
发明人 |
Ichikawa Ryoichi |
| 分类号 |
H01L41/053 |
主分类号 |
H01L41/053 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic device, comprising:
a substrate; and a lid, being bonded on the substrate to seal an inside of the lid using a resin, wherein the lid includes a contact surface in contact with the resin, the contact surface including a rough surface with an uneven shape. |
| 地址 |
Tokyo JP |
