| 发明名称 |
ENCAPSULATION OF BACKSIDE ILLUMINATION PHOTOSENSITIVE DEVICE |
| 摘要 |
An encapsulation of backside illumination photosensitive device including a circuit sub-mount, a backside illumination photosensitive device, a plurality of conductive terminals, and a heat dissipation structure is provided. The backside illumination photosensitive device includes an interconnection layer and a photosensitive device array, wherein the interconnection layer is located on the circuit sub-mount, and between the photosensitive device array and the circuit sub-mount. The conductive terminals are located between the interconnection layer and the circuit sub-mount to electrically connect the interconnection layer and the circuit sub-mount. The heat dissipation structure is located under the interconnection layer, and the heat dissipation structure and the photosensitive device array are respectively located at two opposite sides of the interconnection layer. |
| 申请公布号 |
US2014291790(A1) |
申请公布日期 |
2014.10.02 |
| 申请号 |
US201313943810 |
申请日期 |
2013.07.17 |
| 申请人 |
Industrial Technology Research Institute |
发明人 |
Hsiao Zhi-Cheng;Dai Ming-Ji;Ko Cheng-Ta |
| 分类号 |
H01L31/024;H01L27/146 |
主分类号 |
H01L31/024 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An encapsulation of backside illumination photosensitive device, comprising:
a circuit sub-mount; a backside illumination photosensitive device, comprising:
an interconnection layer located on the circuit sub-mount;a photosensitive device array, wherein the interconnection layer is located between the photosensitive device array and the circuit sub-mount; a plurality of conductive terminals located between the interconnection layer and the circuit sub-mount to electrically connect the interconnection layer and the circuit sub-mount; and a heat dissipation structure located under the interconnection layer, wherein the heat dissipation structure and the photosensitive device array are respectively located at two opposite sides of the interconnection layer. |
| 地址 |
Hsinchu TW |
