BONDING APPARATUS AND BONDING METHOD

摘要

A bonding apparatus has a light source, a stage, a component holder formed of a light transparent material, a controller, and a driver configured to drive the stage and the component holder under the control of the controller. The component holder includes an incident surface on which light outputted from the light source is made incident, a first reflection surface which is a surface opposite to the incident surface and reflects the incident light from the incident surface, a second reflection surface which reflects the light reflected by the first reflection surface, and an exit surface from which the light reflected by the second reflection surface exits. The bonding apparatus bonds the first component and the second component together with the photo-curing adhesive while holding the second component on the side of the exit surface of the component holder.

主权项

1. A bonding apparatus, comprising:
a light source; a stage on which a first component is to be mounted; a component holder formed of a light transparent material and configured to hold a second component; a controller; and a driver configured to be controlled by the controller to change a distance between the first component mounted on the stage and the second component held by the component holder, wherein the component holder includes an incident surface on which light outputted from the light source is made incident, a first reflection surface which is a surface opposite to the incident surface and reflects the incident light from the incident surface, a second reflection surface which reflects the light reflected by the first reflection surface, and an exit surface from which the light reflected by the second reflection surface exits, and the first component and the second component are bonded together with a photo-curing adhesive in a state where the component holder holds the second component on a side of the exit surface.