| 摘要 |
Subsequent to forming a mold body (31) in which a plurality of semiconductor chips (21) are embedded upon an adhesive sheet (2), an adhesive carrier sheet (1A) is pulled upward with respect to a support substrate (1B). The lower surface of the adhesive carrier sheet (1A) which is in contact with the upper surface (b1) of the support substrate (1B) is non-adhesive, and therefore, it is possible to easily separate the adhesive carrier sheet (1A) and the support substrate (1B) without imparting stress to the functional surface (21b) of a chip (21). Subsequently, the mold body (31) is peeled from the adhesive sheet (2), and a rewiring layer (32) and bumps (33) for connection to the outside are formed on the functional surface (21b). Next, a break is made between each of the chips (21 and 21) that are embedded within the mold body (31), and an individual semiconductor package (35) is acquired. |
